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Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

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Shenzhen Hanast New Material co.,LTD
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Province/State:guangdong
Country/Region:china
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Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

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Brand Name :Hanast
Model Number :HN-5508
Certification :ROHS
Place of Origin :Guangdong,China
MOQ :1kg
Price :USD
Payment Terms :D/A, D/P, T/T
Delivery Time :5-8 days
Packaging Details :25kg/barrel
Name :black potting epoxy
The Mixing Ratio :A:B=5:1
Thermal Conductivity :0.2 W/mK
Color :Transparent,black
Application :PCB/Battery/LED
Customized :Support
Hardness :Shore D 80
Feature :flame retardant insulation, sealing bonding, moisture-proof
Curing time :25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
distortion temperature ℃ :130-150
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Product description:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation, compressive resistance, and bonding strength.

Application:

HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers, ignition coils, high voltage packs, aquarium equipment, anion generators, ultrasonic atomizers, and electronics and other components that require insulation, flame retardant, and temperature resistance. It has flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, temperature resistance, and other main functions.

Before curing builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
A sticky epoxy resin water r liquid specific
c gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
e Period (25℃) Six months x months

processabili

mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing 2 Tensile strength of kg/cm 16-18
2 Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%

The hardness of SHORE A 85-95

distortion

temperature ℃

130-150
low temperature resistant ℃

-30

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting AdhesiveTransparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

Transparent Epoxy Resin Potting Adhesive With High Hardness, Waterproof, Insulating, And Thermal Conductive Circuit Board Potting Adhesive

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