Shenzhen Haneste New Material co.,LTD

Shenzhen Haneste New Material co.,LTD

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Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

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Shenzhen Haneste New Material co.,LTD
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City:shenzhen
Province/State:guangdong
Country/Region:china
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Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

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Brand Name :Hanast
Model Number :HN-5508AB
Certification :ROHS SGS
Place of Origin :Guangdong, China
MOQ :1KG
Price :Negotiable
Payment Terms :T/T
Packaging Details :25KG/barrel
Hardness :Shore D 80
Electrical Insulation :High
Operating Temperature :-40°C to 150°C
Flame Retardant :UL 94 V-0
Thermal Conductivity :0.8 W/m·K
Dielectric Strength :500 V/mil
Chemical Resistance :Excellent
Cure Time :24 hours
Density :1.71±0.05,g/cm3
Color :Transparent
Shrinkage :Less than 0.1%
Viscosity :1000 cps
Appearance :Liquid
Mix Ratio :5:1
Adhesion Strength :500 psi
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View Product Description

Factory Supply Two-Component 10:1 Silicone Encapsulant Waterproof RTV-2 Silicone Potting Rubber Non-corrosive Potting Material For LED Driver

PRODUCT DESCRIPTION

HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.

* Product Application *

Widely used in sealing, electrical, potting, insulation, antifouling, waterproof, shockproof, coating, electronic appliances, and comprehensive household appliances.

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

fore curing

builder

Epoxy resin 5508

Curing agent 5508

pigment

Black / White et al

Ruburn / transparent surface

A sticky epoxy resin water

r liquid specific

c gravity, g / cm3

1.4-1.5

1.05

Viscosity of 25℃

4,500—6,000cp s

150—250cp storage

e Period (25℃)

Six months

x months

processabili

mixing ratio

A: B =5:1 (weight ratio)

Available for a time of 25℃

2-3H (100g mix)

curing time

25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H

After curing

2 Tensile strength of kg/cm

16-18

2 Compressive strength of kg/cm

18-22

Resistance to the voltage of kv/mm

20-22

Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage%

0.35-0.55

Water absorption rate was 25℃ * 24H

<0.03%

The hardness of SHORE A

85-95

distortion

temperature ℃

130-150

low temperature resistant ℃

-30

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED DriverTwo Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

Two Component 10:1 RTV 2 Clear Potting Epoxy Resin Silicone Compound Encapsulant Raw Material For LED Driver

* How to use *

​​ According to the dosage, pour it into the mold after mixing according to A: B=10:1.

Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).

* Packing * ​​

Part A: 10KG / 20KG Plastic Barrel

Part B: 1KG Plastic Barrel

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