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Factory Supply Two-Component 10:1 Silicone Encapsulant Waterproof RTV-2 Silicone Potting Rubber Non-corrosive Potting Material For LED Driver
HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.
* Product Application *
Widely used in sealing, electrical, potting, insulation, antifouling, waterproof, shockproof, coating, electronic appliances, and comprehensive household appliances.

| fore curing | builder | Epoxy resin 5508 | Curing agent 5508 | 
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
| 
 processabili 
 | mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm | 14 1.2*10 | ||
| Volume resistance ofΩ-cm | 15 1.1*10 | ||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 | 
| distortion temperature ℃ | 130-150 | 
| low temperature resistant ℃ | -30 | 



 According to the dosage, pour it into the mold after mixing according to A: B=10:1.
Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).
* Packing * 
Part A: 10KG / 20KG Plastic Barrel
Part B: 1KG Plastic Barrel