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Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics

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Province/State:guangdong
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Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics

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Brand Name :Hanast
Model Number :HN-5508AB
Certification :ROHS SGS
Place of Origin :Guangdong, China
MOQ :1KG
Price :Negotiable
Payment Terms :T/T
Packaging Details :25KG/barrel
Name :Epoxy resin potting adhesive
Type :Two-component epoxy potting sealant glue
Feature :flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, temperature resistance
Application :automobile and motorcycle ignition, LED driver power supply, sensor
Hardness :85-95 shore A
distortion temperature ℃ :130-150
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Silicone Manufacturer Flame Retardant Epoxy Potting Glue For Temperature Sensors Controllers Ignition Coils Epoxy Electronic Potting Glue 5:1 Epoxy Potting Compounds

Product Description:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness

technical parameter

uring builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
A sticky epoxy resin water r liquid specific
c gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
e Period (25℃) Six months x months

processabili

mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing 2 Tensile strength of kg/cm 16-18
2 Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%

The hardness of SHORE A 85-95

distortion

temperature ℃

130-150
low temperature resistant ℃ -30

Product Feature :

HN-5508AB has insulation, flame retardant, and temperature resistance. It has flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, temperature resistance

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics

How to use:

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics

matters need attention:

1. This product is an AB agent, according to the label ratio on the product package, and the mixing ratio is weight ratio and non-volume ratio.

2, AB agent mixing can not be stirred with a round bar without resistance, must be stirred with a flat tool with resistance, it is best to use a small mixer.

3. This product should be placed in a cool and dry place to avoid light, keep the workshop dust-free, and cover the unused glue after opening the lid in time.

4. The performance test data is the test result when the humidity is 60% and the temperature is 25℃, for customer reference only.

5, resin glue stored in a wet environment will exhibit a crystallization phenomenon, please put it in the oven at a low temperature hot dry, and restore its original state.

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