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Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

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Province/State:guangdong
Country/Region:china
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Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

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Brand Name :Hanast
Model Number :HN-5508AB
Certification :ROHS SGS
Place of Origin :Guangdong, China
MOQ :1KG
Price :Negotiable
Payment Terms :T/T, D/A, D/P
Packaging Details :25KG/barrel
Supply Ability :100ton/month
Delivery Time :5-7days
Name :Epoxy resin potting adhesive
Type :Two-component epoxy potting sealant glue
Feature :flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, temperature resistance
Application :automobile and motorcycle ignition, LED driver power supply, sensor
Hardness :85-95 shore A
distortion temperature ℃ :-30℃-150℃
Color :Transparent,black
Mix ratio :5:1;2:1;1:1;3:1
Keywords :potting epoxy resin
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Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

Product Description:

HN-5508A/B epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

Technical Parameter

curing builder Epoxy resin 5508A Curing agent 5508B
pigment Black / White et al Ruburn / transparent surface
A sticky epoxy resin water r liquid specific
c gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
e Period (25℃) Six months x months

processabiliy

mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing 2 Tensile strength of kg/cm 16-18
2 Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%

The hardness of SHORE A 85-95

distortion temperature ℃

130-150
low temperature resistant ℃ -30

Product Feature :

HN-5508AB has insulation, flame retardant, and temperature resistance. It has flame retardant insulation, sealing bonding, moisture-proof earthquake resistance, temperature resistance

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

How to use:

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

matters need attention:

1. This product is an AB agent, according to the label ratio on the product package, and the mixing ratio is weight ratio and non-volume ratio.

2, AB agent mixing can not be stirred with a round bar without resistance, must be stirred with a flat tool with resistance, it is best to use a small mixer.

3. This product should be placed in a cool and dry place to avoid light, keep the workshop dust-free, and cover the unused glue after opening the lid in time.

4. The performance test data is the test result when the humidity is 60% and the temperature is 25℃, for customer reference only.

5, resin glue stored in a wet environment will exhibit a crystallization phenomenon, please put it in the oven at a low temperature hot dry, and restore its original state.

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

Bulk Flame Retardant Silicone Epoxy Resin Potting Compound Glue For Electronics Hardness 90 Epoxy Potting Glue

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