Shenzhen Hanast New Material co.,LTD
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Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable
Product descriptions:
HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product
Product features:
Low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation
| Before curing | builder | Epoxy resin 5508 | Curing agent 5508 |
| pigment | Black / White et al | Ruburn / transparent surface | |
| A sticky epoxy resin water | r liquid specific | ||
| c gravity, g / cm3 | 1.4-1.5 | 1.05 | |
| Viscosity of 25℃ | 4,500—6,000cp s | 150—250cp storage | |
| e Period (25℃) | Six months | x months | |
|
processabili
| mixing ratio | A: B =5:1 (weight ratio) | |
| Available for a time of 25℃ | 2-3H (100g mix) | ||
| curing time | 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H | ||
| After curing | 2 Tensile strength of kg/cm | 16-18 | |
| 2 Compressive strength of kg/cm | 18-22 | ||
| Resistance to the voltage of kv/mm | 20-22 | ||
| Surface resistance ofΩ-cm | 14 1.2*10 | ||
| Volume resistance ofΩ-cm | 15 1.1*10 | ||
| contraction percentage% | 0.35-0.55 | ||
| Water absorption rate was 25℃ * 24H | <0.03% | ||
| The hardness of SHORE A | 85-95 |
| distortion temperature ℃ | 130-150 |
| low temperature resistant ℃ | -30 |
Application:
HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers