Shenzhen Haneste New Material co.,LTD
Shenzhen Haneste New Material co.,LTD
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Customized 10:1 Silicone Potting Compound For Circuit Board Led Driver Power Module Waterproof Two Parts Insulation Potting Glue
HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.
Main Application
It is mainly used in circuit boards, LED power supplies, waterproof power supplies, automotive electronic modules, electrical appliances, light sources, lamps, and their accessories for potting protection. Especially for potting with adhesive requirements on aluminum substrates.
According to the dosage, pour it into the mold after mixing according to A: B=10:1.
Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).
| Before Mixing | ||
| A | B | |
| Exterior | black liquid | Transparent liquid |
| Base chemical composition | Polysiloxane | Polysiloxane |
| Viscosity (cP) (GB/2794-1995) | 2000-2800 | 20-30 |
| Density (g/cm³) (GB/2794-1995) | 1.42±0.02 | - |
| A+B after mixing | ||
| Exterior | black liquid | |
| Base chemical composition | Polysiloxane (Silicone) | |
| Viscosity (cP) (GB/2794-1995) | 2000-2600mpa's | |
| Density (g/cm³) (GB/2794-1995) | 1.40±0.02 | |
| Operating time (25℃, min) | 40-60 | |
| Curing time (25℃, h) | 4-6 | |
| Hardness (shore A) (GB/T531-1999) | 30-40 | |
| Volume resistivity Ω·cm (GB/T 31838.2-2019) | ≥5.0×10 14 |
| Thermal conductivity (W/M▪K) (GB/T 38712-2020) | 0.5±0.1 |
| Dielectric strength (kv/mm) | ≥14 |
| Dielectric constant | ≤3.5 |
| Elongation at break (%) | ≤100% |
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