Shenzhen Haneste New Material co.,LTD
Shenzhen Haneste New Material co.,LTD
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Factory White High Thermal Conductivity Silicone Potting Compound For Circuit Board Connector Potting 1:1 Flexible Potting Glue Flame Retardant For Electronic Components
Product Description:
Two-component addition type silicone potting rubber for electronic components, which can be cured into high-performance elastomer by room temperature or heating.
HN-8806 A/B (1:1)
* Features :
Flexible Rubber – Protects components against thermal cycling stress and mechanical shock.
Low shrinkage rate, no corrosion of components after curing.
Flame retardant, high and low temperature resistance from -50ºC to 250ºC (58°F to 432°F).
Excellent electrical properties and Thermal conductivity.
* Color : Grey (can be customized)
| Test Items | Test Standard | Units | Product test results | |||
| Part A | Part B | |||||
| Before curing | 1 | Appearance | --- | --- | Grey, fluid | White, fluid |
| 2 | Viscosity | GB/T10247-2008 | 25ºC, mPa·S | 4500~5000 | 4500~5000 | |
| 3 | Density | GB/T 13354-92 | 25ºC, g/cm³ | 1.50±0.05 | 1.50±0.05 | |
| 4 | Mixing Ratio (A : B) | 1:01 | Weight ratio | 100 | 100 | |
| Volume ratio | 100 | 100 | ||||
| 5 | Operating time | Measured | hr | 0.3-0.4 | ||
| 6 | Curing condition | Measured | hr | 4^12 (25ºC,initial cure) | ||
| 0.20 (80ºC) | ||||||
| After Curing | 7 | Appearance | --- | --- | Grey elastomer | |
| 8 | Hardness | GB/T 531.1-2008 | Shore A | 50±5 | ||
| 9 | Thermal conductivity | GB/T10297-1998 | w/m·k | ≥0.76 | ||
| 10 | Expansivity | GB/T20673-2006 | μm/(m,ºC) | 210 | ||
| 11 | Moisture Absorption | GB/T 8810-2005 | 24h,25ºC, % | 0.01~0.02 | ||
| 12 | Volume resistivity | GB/T 1692-92 | (DC500V),Ω · cm | 1.0×10¹⁵ | ||
| 13 | Dielectric intensity | GB/T 1693-2007 | Kv/mm(25ºC) | 18^25 | ||
| 14 | Temperature Resistance | Measured | ºC | -50~+250°c | ||
1. When used, weigh A and B according to proportion and then mix them evenly.
Mix thoroughly and evenly with a clean stirring device in a clean container, and then potting can be done.
It can also be sealed under a vacuum after removing the bubbles.
2. The surface of the potting element needs to be cleaned.
If the potting product is too large, it is recommended to potting in stages and then cure at room temperature (4-12hr) or by heating (80ºC-0.5hr).
3. For the automatic potting production line, in order to ensure accurate mixing ratio of A and B, Part A and Part B should be vacuumed respectively to remove the bubbles (the foaming time is 5-10 minutes), and then A and B should be pumped to the static mixer in proportion with a metering pump, and then potting can be done after mixing evenly.
