Shenzhen Haneste New Material co.,LTD

Shenzhen Haneste New Material co.,LTD

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2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

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Shenzhen Haneste New Material co.,LTD
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Province/State:guangdong
Country/Region:china
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2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

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Brand Name :Hanast
Model Number :HN-8806AB
Certification :MSDS
Place of Origin :CHINA
MOQ :1KG
Price :4.6
Payment Terms :T/T
Supply Ability :1000000KG
Delivery Time :3-7 work days
Packaging Details :Plastic/Iron Drums
Product name :Silicone potting glue
Color :Black/White/Transparent color, can customized
Application :PCB/Battery/LED
Package :5kgs/25kgs/200kgs/bag
Material :Silicone&Agent
Keywords :Waterproof Sealant
Viscosity :Excellent Viscosity
Certificate :MSDS RoHS UL
Feature :Low and high Temperature Resistance
Thermal conductivity :Customize
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Product Specification

Test Items Test Standard Units Product test results
Part A Part B
Before curing 1 Appearance --- --- Grey, fluid White, fluid
2 Viscosity GB/T10247-2008 25ºC, mPa·S 4500~5000 4500~5000
3 Density GB/T 13354-92 25ºC, g/cm³ 1.50±0.05 1.50±0.05
4 Mixing Ratio (A : B) 1:01 Weight ratio 100 100
Volume ratio 100 100
5 Operating time Measured hr 0.3-0.4
6 Curing condition Measured hr 4^12 (25ºC,initial cure)
0.20 (80ºC)
After
Curing
7 Appearance --- --- Grey elastomer
8 Hardness GB/T 531.1-2008 Shore A 50±5
9 Thermal conductivity GB/T10297-1998 w/m·k ≥0.76
10 Expansivity GB/T20673-2006 μm/(m,ºC) 210
11 Moisture Absorption GB/T 8810-2005 24h,25ºC, % 0.01~0.02
12 Volume resistivity GB/T 1692-92 (DC500V),Ω · cm 1.0×10¹⁵
13 Dielectric intensity GB/T 1693-2007 Kv/mm(25ºC) 18^25
14 Temperature Resistance Measured ºC -50~+250°c

Product Advantages

High-Performance Elastomer: Forms a high-elasticity, high-strength protective layer after curing.

Low Viscosity: Suitable for deep-section potting, ensuring even distribution.

No By-Products: No heat or by-products are emitted during curing, ensuring component safety.

Flame Retardant: Passes UL-94 flame retardancy tests, ensuring safety in high-temperature environments.

Eco-Friendly Certification: Complies with RoHS standards, non-polluting.

2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

Applications

Potting and sealing of power modules, circuit boards, and high-voltage transformers.

Protection and thermal management for battery packs and fast-charging adapters.

Moisture-proof and waterproof protection for LED outdoor drive power supplies.

Other electronic components requiring vibration, water, and thermal protection.

Application Method

1.Mix components A and B in a 1:1 ratio, stir thoroughly, and then proceed with potting.

2.Ensure the surface of the components is clean before potting. For large products, pot in stages.

3.For automated production lines, vacuum components A and B separately to ensure accurate mixing ratio.

2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

Technical Parameters

Appearance: Part A – Grey fluid; Part B – White fluid

Viscosity: 4500~5000 mPa·S

Density: 1.50±0.05 g/cm³

Mixing Ratio (A:B): 1:1

Pot Life: 0.3-0.4 hours

Curing Conditions: 4-12 hours at room temperature (initial cure), 0.2 hours at 80°C

Hardness: 50±5 Shore A

Thermal Conductivity: ≥0.76 W/m·K

Volume Resistivity: 1.0×10¹⁵ Ω·cm

Temperature Resistance: -50°C to +250°C

Packaging
10KG/Set (A 5kg + B 5kg)
20KG/Set (A 10kg + B 10kg)
50KG/Set (A 25kg + B 25kg)

2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

Precautions

Stir components A and B separately before use to ensure even mixing.

Avoid contact with substances containing tin, sulfur, or amines to prevent curing inhibition.

Maintain cleanliness during use to prevent contamination.

   
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