Shenzhen Haneste New Material co.,LTD
Shenzhen Haneste New Material co.,LTD
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Rtv Silicone Potting Compound Flexible Adhesive Insulation Waterproof Conductive For PCB Power Supply Transformer Batteries
HN-8808 two-component room temperature curing potting silicone
Product Specification
| №. | Items | Technique Request |
|---|---|---|
| 1 | Exterior | Transparent / White / Grey Liquid |
| 2 | Viscosity mPa.S (before curing) | A: 2000, B: 50 |
| 3 | Specific gravity (23℃) | 0.98 |
| 4 | In commission time (h, 25℃) | 1–2h |
| 5 | Entirely sulfuration time (min, 25℃) | 8–12h |
| 6 | Hardness (JIS A) | 25A |
| 7 | Volume resistivity (Ω·cm) | ≥1×10¹⁴ |
| 8 | Strength of breakdown voltage (kV/mm) | 18–25 |
| 9 | Dielectric constant (1MHz) | 2.5–3.0 |
| 10 | Dielectric loss (1MHz) | ≤4×10⁻³ |
| 11 | Thermal conductivity (W/m·K) | 0.1–0.20 |
Product Details
HN-8808 is a two-component room-temperature curing silicone specifically designed for the electronics industry. It offers excellent electrical properties and temperature resistance, making it ideal for PCB potting, sensor sealing, and LED encapsulation.
High Insulation: Volume resistivity ≥1×10¹⁴ Ω·cm, breakdown voltage strength 18-25 kV/mm.
High-Temperature Resistance: Operating temperature range from -57°C to 250°C, suitable for high-temperature environments.
Fast Curing: Fully cures in 8-12 hours at room temperature, improving production efficiency.
Viscosity (Part A: 2000 mPa.S, Part B: 50 mPa.S)
Hardness (JIS A): 25A
Dielectric Constant (1MHz): 2.5-3.0
Thermal Conductivity: 0.1-0.20 W/m·K
PCB Potting: Protects circuit boards from moisture and vibration.
Sensor Sealing: Enhances durability and reliability of sensors.
LED Encapsulation: Provides excellent heat dissipation and insulation
Packing specifications
Component A: 10KG/20KG plastic barrel
Component B: 1KG plastic barrel